CMF Phone 2 Pro Chipset Confirmed Ahead of April 28 Launch: MediaTek Dimensity 7300 Pro Powers the Upgrade

April 17, 2025 — With the official launch date of April 28 fast approaching, CMF, the sub-brand of Nothing, has revealed key details about the upcoming CMF Phone 2 Pro — including its MediaTek Dimensity 7300 Pro chipset. The announcement was made via the brand’s official X (formerly Twitter) account, confirming expectations for a performance-focused upgrade over last year’s model.

Dimensity 7300 Pro SoC Brings Performance Boost

The CMF Phone 2 Pro will be powered by MediaTek’s Dimensity 7300 Pro, an upgraded version of the Dimensity 7300 seen in the original CMF Phone 1. According to CMF, the new chipset delivers:

• Up to 10% faster CPU performance

• Up to 5% improved GPU performance

• MediaTek’s 6th-gen NPU with 4.8 TOPS AI performance

The device is also advertised to support 120fps gameplay for BGMI, 1,000Hz touch sampling rate, and a 53% network performance boost, making it an attractive option for gamers and power users alike.

Launch Set Alongside CMF Buds 2 Series

CMF will also unveil the CMF Buds 2, Buds 2a, and Buds 2 Plus alongside the Phone 2 Pro on April 28. All products will be available via Flipkart, where the CMF brand has built a strong following for offering feature-rich devices at accessible price points.

The Phone 2 Pro is expected to continue the minimalist design language of its predecessor, while focusing on delivering a thinner and lighter form factor. Nothing India President Akis Evangelidis recently confirmed that the device will include a charger in the box, a rare move in today’s smartphone market.

What to Expect Based on the CMF Phone 1

Last year’s CMF Phone 1 featured:

• 6.7-inch FHD+ AMOLED LTPS display

• Up to 8GB RAM and 128GB storage

• 50MP dual rear camera setup

• 5,000mAh battery with 33W fast charging and 5W reverse charging

The CMF Phone 2 Pro is expected to maintain or improve upon these core specifications while bringing enhanced gaming and AI performance through its upgraded chipset.